Semiconductor device packages with enhanced heat management and related systems

Semiconductor device packages with enhanced heat management and related systems

A semiconductor device package comprising a carrier substrate having a central well, a logic die facing and operably coupled to TSVs of the carrier substrate, and one or more memory dice in the well and operably coupled to the logic die proximate a surface thereof facing the carrier substrate. An el...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Lunde, Aron T
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device package comprising a carrier substrate having a central well, a logic die facing and operably coupled to TSVs of the carrier substrate, and one or more memory dice in the well and operably coupled to the logic die proximate a surface thereof facing the carrier substrate. An electronic system is also disclosed.