Electronic package and method for fabricating the same
An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a r...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size. |
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