Semiconductor module and semiconductor device

According to one aspect of the present disclosure, a semiconductor module includes a semiconductor chip having a first electrode, a second electrode, and a control electrode to receive a control signal that controls a current flowing between the first electrode and the second electrode, a package having an upper surface, a back surface that is an opposite surface of the upper surface, and a plurality of side surfaces provided between the upper surface and the back surface, the package containing the semiconductor chip, a first terminal provided to the package and being electrically connected to the first electrode, a second terminal provided to the package and being electrically connected to the second electrode and a control terminal electrically connected to the control electrode and being provided on all of the plurality of side surfaces of the package so as to surround the package.