Motor, circuit board, and engine cooling module including the motor

The present invention relates to a motor, a circuit board and an engine cooling module including the motor. The motor includes a stator and a rotor. The stator includes a control module and a heat sink. The control module includes a circuit board and heat generating electronic components mounted on...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Xiong, Minghua, Yan, Xiaojun, Chen, Yun, Zheng, Nan, Xiang, Youqing, Li, Yue
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER COOLING OF INTERNAL-COMBUSTION ENGINES COOLING OF MACHINES OR ENGINES IN GENERAL DYNAMO-ELECTRIC MACHINES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINE PLANTS IN GENERAL GENERATION HEATING LIGHTING MACHINES OR ENGINES IN GENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING NON-POSITIVE DISPLACEMENT PUMPS POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PRINTED CIRCUITS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS STEAM ENGINES WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a motor, a circuit board and an engine cooling module including the motor. The motor includes a stator and a rotor. The stator includes a control module and a heat sink. The control module includes a circuit board and heat generating electronic components mounted on the circuit board. A bottom surface of the circuit board faces the heat sink. The heat generating electronic components are mounted on a top surface of the circuit board. Metal heat conducting members are embedded inside the circuit board at positions corresponding to the heat generating electronic components, and extend along a thickness direction of the circuit board. The heat generated by the heat generating electronic components is conducted from the top surface of the circuit board to the bottom surface of the circuit board. The present invention improves the heat dissipation effect of the motor.