Bending a circuit-bearing die

An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the d...

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Bibliographische Detailangaben
Hauptverfasser:	Toc, Howell John Chua, Venkatesappa, Prakash, Cabonegro, Melvin C, Yang, Annabelle Q
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY ELECTROGRAPHY HOLOGRAPHY PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:	An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.