Slotted electrostatic chuck

An assembly for clamping semiconductor wafers includes a plate and an electrostatic chuck mounted on the plate. A plurality of slots extends between respective portions of the electrostatic chuck to receive arms of an end-effector of a wafer-handler. The arms of the end-effector support semiconducto...

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Bibliographische Detailangaben
Hauptverfasser: Jiang, Haoran, Balan, Aviv
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An assembly for clamping semiconductor wafers includes a plate and an electrostatic chuck mounted on the plate. A plurality of slots extends between respective portions of the electrostatic chuck to receive arms of an end-effector of a wafer-handler. The arms of the end-effector support semiconductor wafers being placed onto and removed from the electrostatic chuck.