Assembling apparatus and assembling method for semiconductor manufacturing apparatus

Assembling apparatus and assembling method for semiconductor manufacturing apparatus

Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Takahashi, Michihiro, Inoue, Hisashi, Kumagai, Yoshihisa, Kobayashi, Masahiro, Kikuchi, Hiroshi, Hatakeyama, Tamotsu, Hasegawa, Harunari
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
COMBINED OPERATIONS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.