Radiation imaging apparatus, manufacturing method thereof, and radiation imaging system

A radiation imaging apparatus includes a sensor base, a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator positioned on a side opposite...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Ishii, Takamasa, Hoshina, Tomohiro, Nishibe, Kota
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF NUCLEAR OR X-RADIATION MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A radiation imaging apparatus includes a sensor base, a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member that bonds the sensor array and the scintillator, and a plurality of bonding sheets that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.