Support and method for producing semiconductor device-mounting substrate using the same

A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).

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Bibliographische Detailangaben
Hauptverfasser: Kawashita, Kazuaki, Ogashiwa, Takaaki, Kato, Yoshihiro, Hirano, Shunsuke
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).