Deposition apparatus including a heat dissipation member

A deposition apparatus includes a chamber, a deposition source, and a stage disposed in the chamber with a target object mounted thereon. The deposition apparatus further includes a first plate coupled to the chamber, and a second plate disposed between the first plate and the stage, wherein the sec...

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Bibliographische Detailangaben
Hauptverfasser:	Ban, Sook-hwan, Park, Jongho, Song, Jinoh, Yoo, Hyeongsuk
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition apparatus includes a chamber, a deposition source, and a stage disposed in the chamber with a target object mounted thereon. The deposition apparatus further includes a first plate coupled to the chamber, and a second plate disposed between the first plate and the stage, wherein the second plate includes a plurality of diffusion holes. The deposition apparatus additionally includes a heat dissipation member in contact with the first plate and the second plate, wherein the heat dissipation member includes a plurality of sidewall portions, wherein the plurality of sidewall portions are connected to each other. The deposition apparatus further includes a spacer coupled to a first sidewall portion of the plurality of sidewall portions and disposed between the first plate and the second plate, wherein the spacer extends parallel to the first sidewall portion.