Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate

Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate

A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surfa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Saltas, Mark, Tomita, Yoshihiro, Liff, Shawna M, Gosselin, Timothy A, Eitan, Amram, Li, Eric J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.