Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same

A method for manufacturing a semiconductor device package includes: accommodating a substrate in a cavity in a center of a carrier substrate having the cavity in which a substrate with a semiconductor chip mounted thereon is accommodated in the center, having a support portion in contact with a side...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ko, Yeong Kwon, Kang, Un Byoung, Heo, Jun Yeong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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