Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same

A method for manufacturing a semiconductor device package includes: accommodating a substrate in a cavity in a center of a carrier substrate having the cavity in which a substrate with a semiconductor chip mounted thereon is accommodated in the center, having a support portion in contact with a side...

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Bibliographische Detailangaben
Hauptverfasser:	Ko, Yeong Kwon, Kang, Un Byoung, Heo, Jun Yeong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method for manufacturing a semiconductor device package includes: accommodating a substrate in a cavity in a center of a carrier substrate having the cavity in which a substrate with a semiconductor chip mounted thereon is accommodated in the center, having a support portion in contact with a side wall of the cavity to form an upper surface of the side wall and surrounding the cavity, and formed of a light-transmitting material; defining a molding portion of the substrate by pressing the support portion and an edge region of the substrate; and molding the molding portion, to cover the semiconductor chip.