Encoder based machining quality prognostics

A method of measuring quality in a machining operation of a device includes measuring lost motion for at least one axis of the device during the machining operation, calculating a spindle lag of a spindle of the device during the machining operation, determining a lost motion deviation, determining...

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Bibliographische Detailangaben
Hauptverfasser: Hughey, Ethan Timothy, Williford, Richard Earl, Ziada, Youssef
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of measuring quality in a machining operation of a device includes measuring lost motion for at least one axis of the device during the machining operation, calculating a spindle lag of a spindle of the device during the machining operation, determining a lost motion deviation, determining a spindle lag deviation, and identifying a machining defect based on the lost motion deviation coinciding with the spindle lag deviation.