Device manufacturing method

A device manufacturing method includes: exposing a first substrate using a lithographic apparatus to form a patterned layer having first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nomina...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Yagubizade, Hadi, Zhang, Yichen, Simons, Hubertus Johannes Gertrudus, Mahmoodi Baram, Reza, Mos, Everhardus Cornelis, Wei, Xiuhong
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A device manufacturing method includes: exposing a first substrate using a lithographic apparatus to form a patterned layer having first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nominal positions in the first substrate; determining a correction to at least partly compensate for the displacements; and exposing a second substrate using a lithographic apparatus to form a patterned layer having the first features, wherein the correction is applied for or during the exposing the second substrate.