Dummy MOL removal for performance enhancement

The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a plurality of gate structures over a substrate, and forming a plurality of source and drain regions along opposing sides of the plurality of gate structures. A plur...

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Bibliographische Detailangaben

Hauptverfasser:	Yang, Hui-Ting, Chen, Chun-Kuang, Shen, Meng-Hung, Sio, Kam-Tou, Chen, Chih-Liang, Lai, Chih-Ming, Tzeng, Jiann-Tyng, Liu, Ru-Gun, Lin, Wei-Cheng, Young, Charles Chew-Yuen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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