Semiconductor device and method of manufacturing the same

Provided herein may be a semiconductor device. The semiconductor device may include a first substrate, a second substrate disposed on the first substrate, a stack which is disposed on the second substrate and includes stacked memory cells, and a discharge contact structure electrically coupling the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Shim, Sung Bo, Choi, Jung Dal
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided herein may be a semiconductor device. The semiconductor device may include a first substrate, a second substrate disposed on the first substrate, a stack which is disposed on the second substrate and includes stacked memory cells, and a discharge contact structure electrically coupling the second substrate with the first substrate such that charges in the second substrate are discharged to the first substrate.