RFID tag assembly methods

Methods of RFID tag assembly include affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenn...

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Bibliographische Detailangaben
Hauptverfasser: Colleran, William T, Oliver, Ronald A, Ma, Yanjun, Fassett, Jay M, Moretti, Vincent C, Koepp, Ronald L
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Methods of RFID tag assembly include affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.