Virtual sensor for spatially resolved wafer temperature control

The present disclosure relate to methods and apparatus for temperature sensing and control during substrate processing. Substrate temperatures during processing, which are difficult to measure directly, may be determined by examination of deposited film properties or by measuring changes in power ou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mungekar, Hemant, Haller, Uwe P, Balasubramanian, Ganesh
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure relate to methods and apparatus for temperature sensing and control during substrate processing. Substrate temperatures during processing, which are difficult to measure directly, may be determined by examination of deposited film properties or by measuring changes in power output over time of the substrate heating apparatus. Temperatures are determined for many substrates during processing, showing how substrate temperatures change over time, and the temperature changes are then used to build models via machine learning techniques. The models are used to adjust heating apparatus setpoints for future processing operations.