Printed circuit board and method of manufacturing printed circuit board

Printed circuit board and method of manufacturing printed circuit board

According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conducti...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Okaue, Junichi, Ohsuka, Ryuta, Sakai, Shoichiro, Nitta, Koji
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Okaue, Junichi
Ohsuka, Ryuta
Sakai, Shoichiro
Nitta, Koji
description According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 μm.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11013124B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11013124B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11013124B23</originalsourceid><addsrcrecordid>eNrjZHAPKMrMK0lNUUjOLEouzSxRSMpPLEpRSMxLUchNLcnIT1HIT1PITcwrTUtMLikFqk1XKMCmg4eBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxIcGGxoaGBobGpk4GRkTowYAdl80Gw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed circuit board and method of manufacturing printed circuit board</title><source>esp@cenet</source><creator>Okaue, Junichi ; Ohsuka, Ryuta ; Sakai, Shoichiro ; Nitta, Koji</creator><creatorcontrib>Okaue, Junichi ; Ohsuka, Ryuta ; Sakai, Shoichiro ; Nitta, Koji</creatorcontrib><description>According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 μm.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210518&amp;DB=EPODOC&amp;CC=US&amp;NR=11013124B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210518&amp;DB=EPODOC&amp;CC=US&amp;NR=11013124B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Okaue, Junichi</creatorcontrib><creatorcontrib>Ohsuka, Ryuta</creatorcontrib><creatorcontrib>Sakai, Shoichiro</creatorcontrib><creatorcontrib>Nitta, Koji</creatorcontrib><title>Printed circuit board and method of manufacturing printed circuit board</title><description>According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 μm.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPKMrMK0lNUUjOLEouzSxRSMpPLEpRSMxLUchNLcnIT1HIT1PITcwrTUtMLikFqk1XKMCmg4eBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxIcGGxoaGBobGpk4GRkTowYAdl80Gw</recordid><startdate>20210518</startdate><enddate>20210518</enddate><creator>Okaue, Junichi</creator><creator>Ohsuka, Ryuta</creator><creator>Sakai, Shoichiro</creator><creator>Nitta, Koji</creator><scope>EVB</scope></search><sort><creationdate>20210518</creationdate><title>Printed circuit board and method of manufacturing printed circuit board</title><author>Okaue, Junichi ; Ohsuka, Ryuta ; Sakai, Shoichiro ; Nitta, Koji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11013124B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Okaue, Junichi</creatorcontrib><creatorcontrib>Ohsuka, Ryuta</creatorcontrib><creatorcontrib>Sakai, Shoichiro</creatorcontrib><creatorcontrib>Nitta, Koji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Okaue, Junichi</au><au>Ohsuka, Ryuta</au><au>Sakai, Shoichiro</au><au>Nitta, Koji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed circuit board and method of manufacturing printed circuit board</title><date>2021-05-18</date><risdate>2021</risdate><abstract>According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 μm.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11013124B2
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Printed circuit board and method of manufacturing printed circuit board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T20%3A43%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Okaue,%20Junichi&rft.date=2021-05-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11013124B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true