Printed circuit board and method of manufacturing printed circuit board

According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conducti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Okaue, Junichi, Ohsuka, Ryuta, Sakai, Shoichiro, Nitta, Koji
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 μm.