Magnetoresistive random access memory and method for fabricating the same

A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate; forming a first top electrode on the first MTJ and a second top electrode on the second MTJ; forming a first ultra low-k (ULK) dielectric layer on t...

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Bibliographische Detailangaben
Hauptverfasser: Li, Kun-Ju, Shih, Yu-Lung, Li, Chih-Yueh, Tsai, Bin-Siang, Tsai, Fu-Yu, Liu, Hsin-Jung, Hou, Chau-Chung, Chan, Ang, Hou, Tai-Cheng, Lu, Chun-Tsen
Format: Patent
Sprache:eng
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Zusammenfassung:A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate; forming a first top electrode on the first MTJ and a second top electrode on the second MTJ; forming a first ultra low-k (ULK) dielectric layer on the first MTJ and the second MTJ; forming a passivation layer on the first ULK dielectric layer, wherein a bottom surface of the passivation layer between the first MTJ and the second MTJ is lower than a top surface of the first MTJ; and forming a second ULK dielectric layer on the passivation layer.