Profile of through via protrusion in 3DIC interconnect

Profile of through via protrusion in 3DIC interconnect

An interconnect structure for an integrated circuit, such as a three dimensional integrated circuit (3DIC), and a method of forming the same is provided. An example interconnect structure includes a substrate, a through via extending through the substrate, and a liner disposed between the substrate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wu, Tsang-Jiuh, Lai, Kuan-Liang, Yu, Chen-Hua, Chung, Ming-Tsu, Yang, Ku-Feng, Chiou, Wen-Chih, Wu, Jiung, Shih, Hong-Ye, Jeng, Shin-Puu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An interconnect structure for an integrated circuit, such as a three dimensional integrated circuit (3DIC), and a method of forming the same is provided. An example interconnect structure includes a substrate, a through via extending through the substrate, and a liner disposed between the substrate and the through via. The substrate includes a tapered profile portion. The tapered profile portion abuts the liner.