Semiconductor encapsulation structure

Provided is a semiconductor encapsulation structure, including: a device base (1) and a cover plate (2). The device base is provided with a cavity (11) for accommodating a chip (3). The device base is further provided with a cover-plate sintered layer (12). The cover-plate sintered layer is metalliz...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Pei, Xiaoming, You, Zhi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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