Glass substrate and laminated substrate

A first aspect of the present invention relates to a glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1%, a devitrification-temperature viscosity of 103.2 dPa·s or higher, and an average coefficient of thermal expansion α at 30 to...

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Bibliographische Detailangaben
Hauptverfasser:	Ono, Kazutaka, Sawamura, Shigeki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING
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Beschreibung
Zusammenfassung:	A first aspect of the present invention relates to a glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1%, a devitrification-temperature viscosity of 103.2 dPa·s or higher, and an average coefficient of thermal expansion α at 30 to 220° C. of 7.80 to 9.00 (ppm/° C.). A second aspect of the present invention relates to a glass substrate which is to be used for a support substrate for semiconductor packages, the glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1% and a photoelastic constant of 10 to 26 nm/cm/MPa.