Apparatus related to conformal coating implemented with surface mount devices

Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the...

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Bibliographische Detailangaben
Hauptverfasser:	Chen, Howard E, Nguyen, Hoang Mong, Read, Matthew Sean, Deorio, Lori Ann, Darveaux, Robert Francis, Lobianco, Anthony James
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS RESONATORS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSMISSION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.