Insulating film and printed circuit board including the same

Insulating film and printed circuit board including the same

An insulating film includes an insulating layer and a surface bonding layer disposed on the insulating layer. The surface bonding layer includes a radical generation element and a coordinate bond element. In the surface bonding layer, a/b is 0.05 or more and 0.35 or less, in which 'a' is a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lee, Junghyun, Lee, Youngju, Yoon, Changhyun, Lee, Choonkeun, Park, Seong-Chan
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Beschreibung
Zusammenfassung:An insulating film includes an insulating layer and a surface bonding layer disposed on the insulating layer. The surface bonding layer includes a radical generation element and a coordinate bond element. In the surface bonding layer, a/b is 0.05 or more and 0.35 or less, in which 'a' is an atom content of the coordinate bond element and 'b' is an atom content of the radical generation element.