Radio frequency power amplifier and power amplifier module

In a radio frequency power amplifier, a semiconductor chip includes at least one first transistor amplifying a radio frequency signal, a first external-connection conductive member connected to the first transistor, a bias circuit including a second transistor that applies a bias voltage to the firs...

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Bibliographische Detailangaben
Hauptverfasser: Sasaki, Kenji, Obu, Isao, Tsutsui, Takayuki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In a radio frequency power amplifier, a semiconductor chip includes at least one first transistor amplifying a radio frequency signal, a first external-connection conductive member connected to the first transistor, a bias circuit including a second transistor that applies a bias voltage to the first transistor, and a second external-connection conductive member connected to the second transistor. The second external-connection conductive member at least partially overlaps with the second transistor when viewed in plan.