Condensation suppressing method and processing system

Condensation on a member of a processing apparatus can be suppressed. A condensation suppressing method of suppressing condensation in a processing apparatus configured to perform a processing on a processing target object includes a first measurement process, a second measurement process and a firs...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	Kamata, Koji
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Condensation on a member of a processing apparatus can be suppressed. A condensation suppressing method of suppressing condensation in a processing apparatus configured to perform a processing on a processing target object includes a first measurement process, a second measurement process and a first control process. In the first measurement process, a first surface temperature of a member of the processing apparatus, which is exposed within a closed space, is measured. In the second measurement process, a dew-point temperature of air within the closed space is measured. In the first control process, a supply amount of low-dew-point air, which has a dew-point temperature lower than a dew-point temperature of air outside the processing apparatus, into the closed space is controlled based on the first surface temperature and the dew-point temperature of the air within the closed space.