Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate

Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate

A wiring substrate includes: a wiring structure that includes a wiring layer and an insulating layer laminated; a plurality of first posts that are formed along a periphery of a predetermined area on a surface of the wiring structure, and that protrude out from the surface of the wiring structure; a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Miki, Shota, Murayama, Kei, Aizawa, Mitsuhiro, Kobayashi, Naoki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A wiring substrate includes: a wiring structure that includes a wiring layer and an insulating layer laminated; a plurality of first posts that are formed along a periphery of a predetermined area on a surface of the wiring structure, and that protrude out from the surface of the wiring structure; and a second post that is connected to the wiring layer at a position surrounded by the first posts, and that protrudes out from the surface of the wiring structure. The first posts are formed such that a post arranged at a central portion of a side constituting the periphery of the predetermined area is lower in height from the surface of the wiring structure than posts arranged at both ends of the side.