Module and method of manufacturing module

A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the fir...

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Bibliographische Detailangaben
Hauptverfasser:	Aoki, Yu, Tsuduki, Koji, Nozu, Satoshi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.