Semiconductor package and method of manufacturing the same
Provided are a semiconductor package and a method of manufacturing the same, the semiconductor package including an interconnection part including an insulation layer and an interconnection layer, a semiconductor chip disposed on the interconnection part and electrically connected to the interconnec...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Provided are a semiconductor package and a method of manufacturing the same, the semiconductor package including an interconnection part including an insulation layer and an interconnection layer, a semiconductor chip disposed on the interconnection part and electrically connected to the interconnection layer through a bonding pad, and an EMI shielding part connected to the interconnection layer while covering the semiconductor chip and the interconnection part. |
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