Method and composition for sealing a subsurface formation

A method for plugging and sealing subsurface formations using alkaline nanosilica dispersion and a delayed activation chemistry is disclosed. In accordance with one embodiment of the present disclosure, the method includes introducing a mixture with a first pH into the subsurface formation. The mixt...

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Bibliographische Detailangaben
Hauptverfasser:	Kalgaonkar, Rajendra Arunkumar, Wagle, Vikrant
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY DYES EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FIXED CONSTRUCTIONS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MINING MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS PAINTS POLISHES
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Beschreibung
Zusammenfassung:	A method for plugging and sealing subsurface formations using alkaline nanosilica dispersion and a delayed activation chemistry is disclosed. In accordance with one embodiment of the present disclosure, the method includes introducing a mixture with a first pH into the subsurface formation. The mixture comprises an aqueous solution, an alkaline nanosilica dispersion and a water-soluble hydrolyzable compound. The method further includes allowing the water-soluble hydrolyzable compound to hydrolyze in the subsurface formation to form an acid at 70° C. or greater, thereby acidizing the mixture to a reduced second pH and causing the alkaline nanosilica dispersion to gel into a solid and seal the subsurface formation. A composition for sealing a subsurface formation is also disclosed. The composition includes an aqueous mixture including water, an alkaline nanosilica dispersion, and a water-soluble hydrolyzable compound.