Decoy security based on stress-engineered substrates

A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Limb, Scott J, Murphy, Patrick
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. At least one functional device is disposed on the stress-engineered substrate. The stress-engineered substrate is configured to fracture in response to energy applied to the substrate. Fracturing the stress-engineered substrate also fractures the functional device. The system includes at least one decoy device. Fragments of the decoy device are configured to obscure one or more physical characteristics of the functional device and/or one or more functional characteristics of the functional device after the functional device is fractured.