Substrate processing method
A substrate processing method includes a first discharge step of discharging, from the first discharge port which faces a predetermined first region including the rotating center of the upper surface, a low surface tension liquid containing gas containing steam of a low surface tension liquid having...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A substrate processing method includes a first discharge step of discharging, from the first discharge port which faces a predetermined first region including the rotating center of the upper surface, a low surface tension liquid containing gas containing steam of a low surface tension liquid having a larger specific gravity than air and lower surface tension than the processing liquid and not discharging the low surface tension liquid containing gas from the second discharge port which faces a predetermined second region surrounding the outside of the first region on the upper surface of the substrate, and a second discharge step of discharging the low surface tension liquid containing gas from the second discharge port after the first discharge step and not discharging the low surface tension liquid containing gas from the first discharge port. |
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