Conductive wire disposed in a layer

A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Schulte, Donald W, McMahon, Terry, Gault, Amy, Fuller, Anthony M
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LINING MACHINES MEASURING PERFORMING OPERATIONS PHYSICS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TESTING TRANSPORTING TYPEWRITERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.