Insert molded product, electrical signal connector, endoscope, and insert molding method

An insert molded product in which a metal base member and a resin are bonded together includes a ground layer; a noble metal layer formed of a noble metal; a compound layer formed of a compound containing silicon (Si) and oxygen (O); and a mixture layer where the compound and the resin are mixed tog...

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Bibliographische Detailangaben
Hauptverfasser:	Shiga, Naohito, Nakamoto, Junko, Endo, Tetsuya, Shiramizu, Kohei
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, ORSURGICAL ARTICLES CHEMISTRY COMPOSITIONS BASED THEREON CURRENT COLLECTORS DIAGNOSIS DISINFECTION, STERILISATION, OR DEODORISATION OF AIR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING HUMAN NECESSITIES HYGIENE IDENTIFICATION INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICALARTICLES MEDICAL OR VETERINARY SCIENCE METALLURGY METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS INGENERAL ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SURGERY THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	An insert molded product in which a metal base member and a resin are bonded together includes a ground layer; a noble metal layer formed of a noble metal; a compound layer formed of a compound containing silicon (Si) and oxygen (O); and a mixture layer where the compound and the resin are mixed together, wherein the ground layer, the noble metal layer, the compound layer, and the mixture layer are formed in this order on the metal base member, and wherein nickel (Ni) is included in both the compound layer and the mixture layer.