Electronic device including redistribution layer pad having a void

Electronic device including redistribution layer pad having a void

An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hartner, Walter, Geissler, Christian, Haubner, Gerhard, Arcioni, Francesca, Fehler, Robert, Wojnowski, Maciej, Niessner, Martin Richard, Meyer, Thorsten
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.