Integrated circuit package structure and package method

An integrated circuit package structure and a package method. The integrated circuit package structure includes: a semiconductor chip, an encapsulation layer covering the semiconductor chip, the encapsulation layer including a first encapsulation layer and a second encapsulation layer alternately stacked, a sum of a number of the first encapsulation layer and a number of the second encapsulation layer being at least 3; wherein a thermal expansion coefficient of one of the first encapsulation layer and the second encapsulation layer is positive, and a thermal expansion coefficient of the other of the first encapsulation layer and the second encapsulation layer is negative.