Matching method and plasma processing apparatus

A method of performing impedance matching between a power supply section of a plasma processing apparatus and a chamber in the plasma processing apparatus is provided. The plasma processing apparatus includes multiple matchers, each configured to perform impedance matching between the power supply section and the chamber, and the power supply section is configured to output superimposed voltage in which radio frequency voltage is superimposed on pulsating DC voltage. According to the method, the superimposed voltage from the power supply section is applied to the chamber, through one of the provided matchers, and the matcher through which the superimposed voltage is applied to the chamber is then switched in accordance with a state of the pulsating DC voltage.