Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof

Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof

An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kapusta, Christopher James, Tuominen, Risto Ilkka Sakari, Fillion, Raymond Albert, Nagarkar, Kaustubh Ravindra
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structure has a sloped outer surface. A conductive layer encapsulates the electrical component and the sloped outer surface of the insulating structure. A first wiring layer is formed on a second surface of the support substrate. The first wiring layer is coupled to the conductive layer through at least one via in the support substrate.