Mounting body manufacturing method and anisotropic conductive film

A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Sekiguchi, Morio, Yamada, Yasunobu, Kumakura, Susumu
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6≤B/A≤1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.