High-precision bond head positioning method and apparatus

After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its f...

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Bibliographische Detailangaben

Hauptverfasser:	Yung, Chung Sheung, Sze, Wui Fung, Deng, Jiangwen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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