High-precision bond head positioning method and apparatus

After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its f...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Yung, Chung Sheung, Sze, Wui Fung, Deng, Jiangwen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its focal plane configured at a first distance from the second optical system. After the bond head is moved adjacent to the second optical system, the second optical system views and determines a position and orientation of the bond head when the second optical system has its focal plane configured at a second distance from the second optical system. The position and orientation of the die may then be adjusted to correct a relative offset between the die and the bonding location prior to depositing the die onto the bonding location.