Flux and solder paste

Provided are a flux having improved wetting and spreading properties and capable of suppressing the occurrence of dewetting and a solder paste using this flux. The flux includes a total amount of 0.5 wt % or more and 20 wt % or less of: any of a dimer acid which is a reaction product of oleic acid a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Nishizaki, Takahiro, Kawasaki, Hiroyoshi, Takagi, Yoshinori
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided are a flux having improved wetting and spreading properties and capable of suppressing the occurrence of dewetting and a solder paste using this flux. The flux includes a total amount of 0.5 wt % or more and 20 wt % or less of: any of a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, or a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid; or two or more of a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid. The solder paste includes this flux and a metal powder.