Encapsulant for PV module, method of manufacturing the same and PV module comprising the same

The present application relates to an encapsulant for a PV module, a method of manufacturing the same, and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep properties, exhibits a haze with a certain level...

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Bibliographische Detailangaben
Hauptverfasser:	Jung, Je Sik, Lee, Jung Youn, Kim, Hyun Cheol
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	The present application relates to an encapsulant for a PV module, a method of manufacturing the same, and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep properties, exhibits a haze with a certain level or less and excellent optical properties such as transparency or the like, when the encapsulant is applied to a PV module, physical properties such as durability, transparency, or the like are improved, and thus excellent generating efficiency of the PV module may be obtained.