Chip package with cross-linked thermoplastic dielectric

Chip package with cross-linked thermoplastic dielectric

A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Meyer-Berg, Georg, Mahler, Joachim, Tutsch, Guenter
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.