Wiring board

A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Jin, Guangzhu, Kaga, Atsushi, Nasu, Takakuni, Kondou, Yousuke, Hattori, Masaomi, Kimata, Kouta
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.