Semiconductor package

A semiconductor package includes a core member having a cavity penetrating through first and second surfaces, a semiconductor chip disposed in the cavity and having an active surface having connection, a passive component module disposed in the cavity, including a plurality of passive components and...

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Bibliographische Detailangaben
Hauptverfasser:	Baek, Yong Ho, Jung, Joo Hwan, Hur, Young Sik
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor package includes a core member having a cavity penetrating through first and second surfaces, a semiconductor chip disposed in the cavity and having an active surface having connection, a passive component module disposed in the cavity, including a plurality of passive components and a resin portion encapsulating the plurality of passive components, and having a mounting surface from which connection terminals of the passive components are exposed, a connection member on the second surface and including a redistribution layer connected to the connection pads of the semiconductor chip and connection terminals of some of the plurality of passive components, connection terminals of the others of the plurality of passive components not being connected to the redistribution layer.