Semiconductor device with conductive film shielding
A packaged semiconductor device has a conductive film that covers a first major surface and surrounding side surfaces of an integrated circuit die. The conductive film provides five-sided shielding of the integrated circuit die. A metal heat sink may be attached to an exposed major surface of the co...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A packaged semiconductor device has a conductive film that covers a first major surface and surrounding side surfaces of an integrated circuit die. The conductive film provides five-sided shielding of the integrated circuit die. A metal heat sink may be attached to an exposed major surface of the conductive film for dissipating heat generated by the die. |
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